Flip-top knob test socket
Clamshell Rotary-Lock Test Socket
Suitable for BGA, QFN, LGA, QFP, SOP, and other package types
Designed for rapid chip verification, testing, and burn-in
Features a rotary-lock mechanism ensuring smooth downward pressure, uniform contact force, and no IC displacement
Compatible with products featuring pitches from 0.4mm to 1.27mm
Replaceable probes allow for easy maintenance and low cost
Mechanical Specifications
Socket Material: PEEK, PPS, Torlon 4203, PEI
Socket Head Material: Aluminum, Copper, POM
Probe Type: Spring-loaded probe
Operating Temperature: -40°C to 140°C
Probe Lifespan: 100,000 cycles
Spring Force: 20g – 30g per pin
Electrical Specifications
Current: 2A
Resistance: 100mΩ
Bandwidth: > 20GHz @ -1dB
What information do I need for a quote?
Please provide the device or package drawing, pitch, pin count, electrical and mechanical requirements, test conditions, quantity, and target delivery date.
Can this product be customized for my device package?
Customization depends on the package drawing, test requirements, operating conditions, and quantity. Contact our engineering team to confirm feasibility.
How are specifications confirmed?
Review the information on this page and send us your drawings and test requirements. Final specifications are confirmed in the quote or technical agreement.
