Kelvin test socket
DFN Kelvin Test Socket
Suitable for packages such as BGA, QFN, LGA, QFP, and SOP;
Used for rapid chip verification, testing, and burn-in;
Clamshell design with dual-latch mechanism for manual or automated loading/unloading;
Suitable for products with pitches ranging from 0.4mm to 1.27mm; compatible with DFN/QFN package sizes from 1x1 to 8x8.
Mechanical Specifications
Socket Material: PEEK, PPS, Torlon 4203, PEI, Torlon 5530
Socket Head Material: Aluminum (AL), Copper (Cu), POM
Probe Type: Spring probe
Operating Temperature: -40°C to 140°C
Kelvin Probe Lifespan: 300,000 cycles
Spring Force: 20g – 30g per pin
Electrical Specifications
Current: 2A (1A per pin)
Resistance: 50mΩ
Bandwidth: >30GHz @ -1dB
What information do I need for a quote?
Please provide the device or package drawing, pitch, pin count, electrical and mechanical requirements, test conditions, quantity, and target delivery date.
Can this product be customized for my device package?
Customization depends on the package drawing, test requirements, operating conditions, and quantity. Contact our engineering team to confirm feasibility.
How are specifications confirmed?
Review the information on this page and send us your drawings and test requirements. Final specifications are confirmed in the quote or technical agreement.
