Open-top programming socket
Suitable for packages such as BGA, QFN, DFN, LGA, QFP, and SOP
Used for rapid chip verification, testing, burn-in, and HAST
Suitable for automated testing
Replaceable probes; easy maintenance and low cost
Socket structure: Downward-pressing (materials include plastic and aluminum alloy)
Suitable for pitches of 0.4mm–1.27mm
Socket materials: Ceramic, PEEK, PPS, Torlon, PEI, Vespel SP-1
Socket head materials: AL, Cu, POM
Conductive materials: Spring probes / Conductive rubber
Operating temperature: -55°C to 155°C
Probe lifespan: >300,000 cycles (results vary based on test conditions)
Spring force: 20g–30g per pin
Burn-in duration: >5,000 hours
Current: 1A
Resistance: 50mΩ
Bandwidth: >10GHz @ -1dB
What information do I need for a quote?
Please provide the device or package drawing, pitch, pin count, electrical and mechanical requirements, test conditions, quantity, and target delivery date.
Can this product be customized for my device package?
Customization depends on the package drawing, test requirements, operating conditions, and quantity. Contact our engineering team to confirm feasibility.
How are specifications confirmed?
Review the information on this page and send us your drawings and test requirements. Final specifications are confirmed in the quote or technical agreement.
