ATE Test Socket
ATE Test Socket (for automated testing equipment); compatible with BGA, QFN, DFN, LGA, QFP, SOP, and other package types.
Designed for rapid chip verification and testing.
Clamshell design supports manual or automated loading/unloading mechanisms.
Replaceable probes ensure easy maintenance and low cost.
Suitable for DFN/QFN packages (sizes 1x1 to 8x8) with pitches ranging from 0.4mm to 1.27mm.
Mechanical Specifications
Socket Body Materials: PEEK, PPS, Torlon 4203, PEI, Torlon 5530
Socket Head Materials: Aluminum (AL), Copper (Cu), POM
Probe Type: Spring probe
Operating Temperature: -40°C to 140°C
Probe Lifespan: 300,000 cycles
Spring Force: 20g – 30g per pin
Electrical Specifications
Current: 2A (1A per pin)
Resistance: 50mΩ
Bandwidth: > 20GHz @ -1dB
What information do I need for a quote?
Please provide the device or package drawing, pitch, pin count, electrical and mechanical requirements, test conditions, quantity, and target delivery date.
Can this product be customized for my device package?
Customization depends on the package drawing, test requirements, operating conditions, and quantity. Contact our engineering team to confirm feasibility.
How are specifications confirmed?
Review the information on this page and send us your drawings and test requirements. Final specifications are confirmed in the quote or technical agreement.
