QFN Test Socket
Suitable for BGA, QFN, LGA, QFP, SOP, and other package types
Used for rapid chip verification, testing, and burn-in
Clamshell design with dual-latch mechanism for manual or automated loading/unloading
Compatible with pitches ranging from 0.4mm to 1.27mm; supports package sizes such as DFN and QFN (1x1 to 8x8)
Mechanical Specifications
Socket Body Materials: PEEK, PPS, Torlon 4203, PEI, Torlon 5530
Socket Head Materials: Aluminum (AL), Copper (Cu), POM
Probe Type: Spring probe
Operating Temperature: -40°C to 140°C
Probe Lifespan: 100,000 cycles (Kelvin probe lifespan: 300,000 cycles)
Spring Force: 20g – 30g per pin
Electrical Specifications
Current: 2A (1A per pin)
Resistance: 50mΩ
Bandwidth: > 20GHz @ -1dB
What information do I need for a quote?
Please provide the device or package drawing, pitch, pin count, electrical and mechanical requirements, test conditions, quantity, and target delivery date.
Can this product be customized for my device package?
Customization depends on the package drawing, test requirements, operating conditions, and quantity. Contact our engineering team to confirm feasibility.
How are specifications confirmed?
Review the information on this page and send us your drawings and test requirements. Final specifications are confirmed in the quote or technical agreement.
