WLCSP (Wafer-Level) Vertical Probe Card
Suitable for chip packages such as BGA and QFN
Designed for rapid chip verification and testing
Suitable for wafer-level packaged chips with a pitch of 0.35mm or greater
Supported temperature range: -55°C to 150°C
Supports multi-site testing
Supports RF performance testing
Supports Kelvin testing
Socket materials: Ceramic, PEEK, PPS, Torlon, PEI, Vespel SP-1
What information do I need for a quote?
Please provide the device or package drawing, pitch, pin count, electrical and mechanical requirements, test conditions, quantity, and target delivery date.
Can this product be customized for my device package?
Customization depends on the package drawing, test requirements, operating conditions, and quantity. Contact our engineering team to confirm feasibility.
How are specifications confirmed?
Review the information on this page and send us your drawings and test requirements. Final specifications are confirmed in the quote or technical agreement.
