Aluminum alloy aging fixture
Burn-in Socket
Suitable for package types: BGA, QFN, LGA, QFP, SOP, etc.
Used for chip burn-in, screening, and verification.
Suitable for products with pitches ranging from 0.4mm to 1.27mm.
Replaceable probes; easy maintenance and low cost.
Mechanical Properties and Material Specifications
Socket plate material: PEEK, ceramic, PPS, Torlon 4203, PEI.
Socket head material: Aluminum, PEI.
Probe type: Spring probe / Leaf spring / Conductive elastomer.
Probe material: Gold-plated beryllium copper.
Operating temperature: -55°C to 175°C.
Service life: 5,000 hours.
Spring force: 20g – 30g per pin.
What information do I need for a quote?
Please provide the device or package drawing, pitch, pin count, electrical and mechanical requirements, test conditions, quantity, and target delivery date.
Can this product be customized for my device package?
Customization depends on the package drawing, test requirements, operating conditions, and quantity. Contact our engineering team to confirm feasibility.
How are specifications confirmed?
Review the information on this page and send us your drawings and test requirements. Final specifications are confirmed in the quote or technical agreement.
