Customized Burn-in Board Solutions
Suitable for device packages such as BGA, QFN, QFP, SOP, TO, and SMD
Suitable for reliability testing of MOSFETs, transistors, and IGBTs
Applicable to various burn-in scenarios, including HTOL, LTOL, HAST, HTRB, HTGB, H3TRB, and high-power burn-in
Socket types: Clamshell, press-fit/downward-pressure, and DIP (materials include plastic and aluminum alloy)
Pitch range: 0.3mm – 2.54mm
Test socket materials: Ceramic, PEEK, PPS, Torlon, PEI, Vespel SP-1
Socket head materials: Aluminum (AL), Copper (Cu), PPS
Conductive materials: Pogo pins or spring contacts
Operating temperature: -55°C to 175°C (sockets with independent temperature control available)
Socket lifespan: >100,000 cycles (results vary based on test conditions)
Spring force: 15g – 30g per pin
What information do I need for a quote?
Please provide the device or package drawing, pitch, pin count, electrical and mechanical requirements, test conditions, quantity, and target delivery date.
Can this product be customized for my device package?
Customization depends on the package drawing, test requirements, operating conditions, and quantity. Contact our engineering team to confirm feasibility.
How are specifications confirmed?
Review the information on this page and send us your drawings and test requirements. Final specifications are confirmed in the quote or technical agreement.
